Amkor Offers Optical Package Solutions for Multiple Applications

https://amkortech.gcs-web.com/news-releases/news-release-details/amkor-offers-optical-package-solutions-multiple-applications

TEMPE, Ariz.--(BUSINESS WIRE)--Dec. 13, 2018-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications, including LIDAR, fingerprint sensing, ambient light sensing and 3D facial recognition.

“Amkor has over 25 years of experience manufacturing and testing MEMS and Sensor devices for automotive, communications and consumer applications,” said John Donaghey, Corporate Vice President, Amkor Technology. “We are excited to extend our high-volume MEMS and Sensor package platforms to address optical market requirements. This allows our customers to bring their solutions to market quickly without sacrificing performance.”

Amkor’s factories are IATF16949 certified and have the ability to meet the rigorous requirements of the AEC-Q100 specification. Full turnkey optical MEMS and Sensor solutions from Amkor include design, assembly and test. To learn more about Amkor’s capabilities in Optical MEMS and Sensor packaging, visit www.amkor.com/technology/optical-sensors/.

About Amkor Technology, Inc.

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operating base includes 11 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in AsiaEuropeand the U.S. For more information, visit www.amkor.com.

Keywords:
OSAT

Semiconductor packaging

Advanced IC packaging

Assembly and test

Optical sensor packaging

Optical sensor test

Heterogenous integration

MEMS

MOEMS

Sensors

BGA

ChipArray®

MicroLeadFrame®

 

Social Media: @amkortechnology


View source version on businesswire.com: https://www.businesswire.com/news/home/20181213005143/en/

Source: Amkor Technology, Inc.

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p.s

AmKor는 아남전자 창업자 아들이 만든 회사로 알고 있는데 패키징 업계(OSAT)에서 매우 큰 업체로 알고 있다.

시그네틱스, 하나마이크론이 삼성 기존 수주 물량이 줄어들면서 사업 다각화로 지문센서 패키징 분야에서 두각을 나타냈지만 업계 선두업체들도 후발로 뛰어든 모양세다. 물론, AmKor 상하이등은 이미 오래전에 고객을 확보한 것으로 알고 있다. 


이 기사와 다른 뉴스로 중국 晶方科技(www.WLCSP.com), 华天-Tianshu Huatian Tech.(http://www.htkjxa.com)长电-Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET), 대만 SPIL이 국내 시그네틱스, AmKor와 더불어 지문센서 웨이퍼 패키징분야에서 두각을 나타내고 있음.