IT/지문센서 업체 및 동향

    진혼곡 2018. 10. 1. 09:21

    Fingerprint chip maker Goodix sued competitor Silead for a capacitor fingerprint product that infringed on three patents and claimed 210 million yuan (30.57 million USD). (source: shoujibao)


    Huiding v. Si Liwei infringed three patent claims for 200 million. The latter is said to be the general technology of the industry.


    Fingerprint chip maker Huiding Technology sued competitor Si Liwei for a capacitor fingerprint product that infringed on three patents and claimed 210 million yuan.
     
      On September 29, the storage chip company Beijing Zhaoyi Innovation Technology Co., Ltd. (Zhaoyi Innovation, 603986) announced that the company issued shares and paid cash to purchase the assets of Shanghai Si Li Microelectronics Technology Co., Ltd. Li Wei), received the Shenzhen Intermediate People's Court of Guangdong Province (2018) Guangdong 03 Minchu 3258, (2018) Yue 03 Min 3259 and (2018) Yue 03 Min 3260 "Responsibility Notice", Civil Prosecutions and other documents.
     
      Huiding Technology
     
      Huiding Technology (603160) sued Si Liwei and Shenzhen Dingxin Wireless Technology Co., Ltd. (referred to as: Dingxin, Sili Wei accused of this capacitor fingerprint product seller) infringed three patents to the Shenzhen Intermediate People's Court. The court was ordered to order Si Liwei and Dingxin to immediately stop infringing the patent rights of Huiding and destroy the infringing products. Each patent claimed 70 million yuan respectively.
     
      The three patents mentioned by Huiding are respectively obtained on November 24, 2017, and the patent number is ZL201410204545.4, and the invention patent named " fingerprint recognition based terminal and its login method and system in standby state" Authorization. On December 19, 2017, the invention patent granted the patent number ZL201410105847.6, called "capacitive fingerprint sensing circuit and sensor". On February 23, 2018, the patent number ZL201720925097.6 was granted, and the utility model patent entitled "Secondary package of through-silicon via chip" was granted.
     
      In response, Sili Wei responded on September 29 that the three patents involved in the lawsuit belong to the information processing circuit design, packaging and terminal system implementation, which are very common technologies in the field. Prior to the three patent application dates, the relevant technology has existed in a number of public documents and applied to a variety of public products. "We believe that the three patents do not meet the requirements of creativity and novelty, and intend to invalidate their applications. ."
     
      Si Liwei also reiterated that the products designed by the company are based on independent research and development technology; the related technologies used in the manufacture of the related capacitive fingerprint products are already public and well-known information, and do not infringe any patents or proprietary technology. “We have good reasons. Questioning the purpose and intention of the above-mentioned competitors to file a patent dispute dispute, our company will actively respond to and adopt all necessary legal measures to safeguard the legitimate rights and interests of the company."
     
      Zhaoyi Innovation announced that the reorganization of the subject matter of this announcement has not yet been heard. According to the preliminary judgment of Sili Wei, the income and profit contribution of the products involved in the lawsuit are relatively small. The patents involved in the lawsuit have existed in a number of public documents and applied to various public products before the patent application date. Sili Wei will be based on the relevant patent laws. Provisions for active response.
     
      Zhaoyi Innovation said that the company is currently communicating with this restructuring intermediary agency and intellectual property professional organization to judge the impact of this lawsuit on the company's major asset restructuring. The company's issue of shares and payment of cash to purchase assets and raise matching funds is subject to further review by the China Securities Regulatory Commission. There is still uncertainty as to whether it can be approved by the China Securities Regulatory Commission.
     
      Founded in 2005, Zhaoyi Innovation is a leading flash memory chip design company in China. Founded in 2010, Sili Wei is also a chip design company whose main products are touch chips and fingerprint chips. In recent years, its rising momentum has been rapid.
     
      On January 30 this year, Zhaoyi Innovation acquired a 100% stake in Si Liwei by issuing shares and paying cash for a total consideration of RMB 1.7 billion. Zhaoyi Innovation will enter the field of touch chips and fingerprint chips to further open up its own industrial chain.


    Recently, the fingerprint world, which was originally in a stagnant water, has suddenly boiled due to the large-scale application of fingerprints under the screen. Half a month ago, a "compassion" between Huiding and OPPO was quickly staged: OPPO announced the ban on the Huiding fingerprint chip for 5 years, and then Huiding publicly apologized. Then OPPO said "under understanding", but to what At the time, the ban was not mentioned.

     
      According to OPPO, the reason behind this is that OPPO and Shenzhen Huiding Technology Co., Ltd. (hereinafter referred to as Huiding) have maintained many years of cooperation in the fields of TP drive and fingerprint sensor. In May 2018, our fingerprint purchasing team and Zhang Fan, chairman of Huiding Technology, communicated on the cooperation of the second generation of screen optical fingerprints. After that, Huiding promised to supply batch quantities of OPPO planning projects. As a result of the operation of the project, our company began to invest resources and prepare materials. However, on June 4, Huiding Technology was forced by other customers to ensure the limited use of other customers and the volume delivery time promised to OPPO. After three months of delay, the OPPO project could not be carried out and the losses were huge.
     
      In this regard, the mobile phone newspaper online has also reported that the project is OPPO R17. After OPPO was unable to supply the Huiding, Sili Wei, who took the opportunity to save the field, took the road to mass production of fingerprints. In the market, as Si Liwei was able to put pressure on Huiding, a patent prosecution case was staged!
     
      Huiding sued Dingxin/Siliwei infringement: Sili Wei Yanzheng declares rights protection
     
      On September 29th, according to Si Liwei and its parent company, Zhaoyi Innovation issued an announcement. Among them, Si Liwei said: Recently, our company received the notice of responding to the patent dispute case of Shenzhen Intermediate People's Court of Guangdong Province. Shenzhen Huiding Technology Co., Ltd. sued Shenzhen Dingxin Wireless Technology Co., Ltd. and our company to the Shenzhen Intermediate People's Court of Guangdong Province, and believed that Shenzhen Dingxin Wireless Technology Co., Ltd. sold “a capacitive fingerprint product manufactured by our company”. Violation of its use of three patents, new and invention."
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront


    In response to the above-mentioned complaints, our company's statement is as follows: 1. The three patents involved in the lawsuit belong to the information processing circuit design, packaging and terminal system implementation, which are very common technologies in the field. Prior to these three patent filing dates, related technologies existed in a number of publications and in a variety of public products. Our company believes that the three patents do not meet the requirements of creativity and novelty, and intends to invalidate the patent for their application.
     
      2. The products designed by our company are all based on independent research and development technology; the related technologies used in the manufacture of the related capacitive fingerprint products have been publicly and publicly known, and have not infringed any patents or proprietary technologies.
     
      3. Since the establishment of our company, we have been taking independent innovation as our core competitiveness, and have been deeply immersed in the fields of touch, fingerprint and high-efficiency biometric sensors. We are committed to the hard work of burying our heads and do not exaggerate publicity, but we must Technology and services can create real value for customers.

    Huiding claims that it obtained the patent number of ZL201410204545.4 on November 24, 2017, and the invention patent entitled " Fingerprint recognition based terminal and its login method and system in standby state", now proposes Sili Weihe Dingxin has not licensed the top to manufacture or sell a certain capacitive fingerprint chip. Huiding believes that the product falls within the scope of its patent protection and proposes the following litigation request:
     
    (1) The order of Si Liwei and Dingxin immediately stopped the infringement of the invention patent right of Huiding No. ZL201410204545.4, including but not limited to the act of manufacturing, using and selling the alleged infringing product; (2) Micro, Dingxin immediately destroyed the infringing products; (3) ordered Siliwei, Dingxin to compensate for the loss of RMB 70 million, and the reasonable cost of Huiding to stop the infringement of 500,000 yuan; (4) Wei and Dingxin bear the legal costs of this case.
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      Huiding alleged that it obtained the patent for the invention entitled “Capacitive Fingerprint Sensing Circuit and Inductor” on December 19, 2017. It is proposed that Siliwei and Dingxin have not been approved by Huiding. To manufacture and sell a certain capacitive fingerprint chip, Huiding believes that the product falls within the scope of its patent protection and proposes the following lawsuit:
     
      (1) The order of Sili Wei and Dingxin immediately stopped the infringement of the invention patent right of Huiding No. ZL201410105847.6, including but not limited to the act of manufacturing and selling the alleged infringing product; (2) Judging the order, Dingxin immediately destroyed the infringing products; (3) ordered Siliwei, Dingxin to compensate for the loss of RMB 70 million, and the reasonable cost of Huiding to stop the infringement of 500,000 yuan; (4) ordered Sili Wei, Dingxin bears the legal costs of this case.
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      Huiding alleged that it obtained the patent number of ZL201720925097.6, which is called the “secondary package of through-silicon via chip” on February 23, 2018. It is proposed that Si Liwei and Dingxin have not been remitted. Top license, manufacture and sale of a certain capacitive fingerprint chip. Huiding believes that the product falls within the scope of its patent protection and proposes the following litigation request:
     
      (1) The order of Si Liwei and Dingxin immediately stopped the infringement of the invention patent right of Huiding No. ZL201720925097.6, including but not limited to the act of manufacturing or selling infringing products; (2) Judging Sili Wei, Dingxin Immediately destroy the infringing products; (3) Order Sili Wei, Dingxin to compensate for the loss of RMB 70 million, and the reasonable cost of Huiding to stop the infringement of 500,000 yuan; (4) Order Sili Wei, Dingxin To bear the legal costs of this case.
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      In addition, the author also contacted Dingxin, according to the author of the direction: "It doesn't matter to us!" (The above three patent details are attached at the end of the article)
     
      Patent prosecution suppresses the other party as the norm: the battle for fingerprints under the screen is changed from dark to bright
     
      In fact, it is really not surprising that the Huiding will sue Si Liwei, and even say that it is completely foreseeable! Some time ago, the author also talked about this issue during the communication with the industry. The industry person revealed to the author: "The good show is behind!"
     
      People in the industry know that if anyone in the fingerprint market can finally compete with Huiding Technology, then from the current point of view, only after the acquisition of Zhaoyi Innovation, Si Liwei; on the other hand, if it is said that Si Liwei If Huiding Technology is only competing in the dark, then this patent event will bring both to the table.
     
      It can even be said that the storm behind the patent prosecution incident lies in the OPPO incident. After OPPO banned the tidal fingerprint chip incident, it undoubtedly made Sili Wei's reputation in the market increase, at least in the mass consumer field. From this point of view, Sili Wei acted as a "fire hero" a role. Through the patents of the three indictments, we can also see that it is not the current hot under-screen fingerprint patent, but a capacitive fingerprint patent that is regarded by the industry as a “general technology”!
     
      In fact, patent prosecution is very common in the mobile phone industry. It is more straightforward. The development of patents has also suppressed the development of competitors. It has become the norm in the industry. In the field of image sensors (CIS) in the past, as the giant of the industry. Wei Technology sued the tens of millions of dollars of SmartSens patent infringement invested by big funds and Lenovo Ventures, but unfortunately, Haowei Technology lost the case!
     
      This phenomenon is also not uncommon in the fingerprint field. For example, a fingerprint chip manufacturer in mainland China has been dead for a long time without a result. For example, a Taiwanese touch and fingerprint chip manufacturer sued a mainland fingerprint chip manufacturer for many years, and it is still deadlocked from the second. For example, although the two sides have been deadlocked for many years, it is not a good thing for a mainland chip printer manufacturer to be sued, and many customers are afraid to adopt their fingerprint chips. More often, for the prosecution, the patent prosecution is not for the purpose of obtaining much compensation, but more for the indicted customer to lose!
     
      Fingerprint chip manufacturers go to the current two roads: screen fingerprint + 3D camera
     
      From the development of the fingerprint chip market, the current traditional capacitive fingerprint chip market price has been going on for a long time. Previously, people in the industry reported to the mobile phone online: "I thought that this year's mobile phone industry market is sluggish, there will be some fingerprint chip manufacturers. Forced to go out, but from the current point of view, everyone is insisting on persistence. Especially at the beginning of this year, FPC began to join the bargaining camp, which did bring some pressure on domestic fingerprint chip manufacturers."
     
      In the long-term price war of capacitive fingerprint chips, the screen fingerprints of the rescue field have finally been mass-produced. According to the mobile phone report online, the fingerprint chip market in this year is only Sili and Huiding. The overall shipments of home companies are conservatively estimated at more than 20 million. In addition to the current large-scale adoption of the screen fingerprint OPPO, vivo and Meizu , in the second half of this year, there will be more mobile phone brands to join the screen fingerprint camp!
     
      As for the fingerprint chip manufacturers, there are mainly two development trends. In addition to continuing to struggle in the traditional capacitive fingerprint market, the vertical direction is to enter the screen fingerprint market, such as Si Liwei, Huiding Technology, Synaptics and so on. In the horizontal direction, it further enters the field of 3D cameras.
     
      According to the mobile phone report online, as early as the beginning of this year, Huiding Technology has announced that it has entered the field of 3D cameras. According to the mobile phone report, its related R&D team mainly comes from overseas; in the near future, another fingerprint chip manufacturer also announced Entering the field of 3D cameras, and will release products next month, that is, the technology that is closely related to Xinyi Technology!
     
      It is understood that the company is headquartered in Shenzhen, China, focusing on the development of 3D face detection technology, providing customers with a complete 3D face detection software and hardware solution. In view of the depth detection field that traditional 2D face detection technology can't realize, 阜时科技 provides customers with complete solutions to improve the security and interactive experience of face detection with its excellent strength and many industry advantages.
     
      The founder is the general manager of Xinyi Technology, Mo Lianghua, who has the academic background of Nanjing University and Hong Kong University of Science and Technology. He has nearly 20 years of research and development experience in the field of sensors. He entered the chip design field earlier in China and is still writing. A typical representative of the new record.
     
      According to reports, starting from 2015, Mo Lianghua began to pay attention to the new human-computer sensing interaction technology. "Traditional touch and display technology can only communicate with users in one direction. Although it is convenient for human-computer interaction, it can also do more." Mo Lianghua believes that "good human-computer interaction technology must make hardware from More levels to understand user needs, not only to perceive, but also to recognize, to create more value for users." Based on the recognition of this concept, Mo Lianghua invested in the late special professors, young thousand experts The 3D printing company founded by Dr. Lu Changshi opened the door to exploring new areas.
     
      At the same time, the development of 3D technology for face detection has also been put on the agenda since then. Prof. Chen Jian from the School of Software, South China University of Technology, and other industry veterans have been invited to become technical consultants. On the basis of continuous integration of technical teams, production, research and research platforms, in 2017, we officially registered and established 3D face detection technology.
     
      Si Li micro-ultrasonic solution breakthrough: reaching mass production level early next year
     
      In addition, with the advent of the full-screen era, due to the limited capacitive scheme, the technical application of the fingerprint under the screen has become a hot spot in the industry. The optical and ultrasound solutions have become the mainstream of development. From the current point of view, the fingerprints under the optical screen are mainly thought. Li Wei, Hui Ding Technology and Xin Si San, as well as pressure touch solutions, while the ultrasonic program is mainly Qualcomm, but this situation is about to be broken by the idea.
     
      Among them, the ultrasonic scheme uses the echo intensity to identify the fingerprint, and has the advantages of oil-proof waterproofing and strong penetrability. The ultrasonic solution uses the ultrasonic wave of a specific frequency emitted by the fingerprint module to scan the finger, and is absorbed and penetrated when the ultrasonic wave reaches the surface of different materials. Different from the degree of reflection, it is possible to identify the position of the fingerprint and the position of the fingerprint by utilizing the difference in sound impedance between the skin and the air or different skin layers.
     
      The advantage of the ultrasound solution is that it is more penetrating, capable of deep subcutaneous fingerprint recognition and can identify living organisms, so the safety of the solution is higher; in addition, the ultrasonic solution is not easily interfered by oil and water stains and strong light, so Unlocking is more stable and reliable, and has become an important direction for the development of fingerprint identification solutions.
     
      Recently, Shanghai Sili Microelectronics has made painstaking research and development in MEMS ultrasonic technology for two years and made breakthrough progress. Its self-developed ultrasonic transducer has passed the series performance test, and the conversion efficiency is up to 1.5% at 10MHz frequency point, showing excellent performance, and has been applied to the development of the next generation ultrasonic fingerprint recognition chip.
     
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      It is reported that the piezoelectric ultrasonic transducer (PMUT) used by Si Liwei uses the piezoelectric effect of aluminum nitride to convert the electrical energy and mechanical energy to detect the ridge information of the finger skin and the dermis layer to make accurate Judgment.
     
      According to reports, aluminum nitride is a very stable piezoelectric material with two important characteristics: the inverse piezoelectric effect and the piezoelectric effect. The inverse piezoelectric effect means that when a voltage is applied across the piezoelectric material, the piezoelectric material is deformed internally, and the shape variable is proportional to the voltage, which is a process of converting electrical energy into mechanical energy; the piezoelectric effect refers to the piezoelectric material. When deformation occurs under the action of force, the positive and negative charge centers of the piezoelectric material are relatively displaced, so that the opposite ends of the piezoelectric material produce oppositely bound charges. The amount of charge is proportional to the pressure, which is the process of converting mechanical energy into electrical energy. .
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      Different from other SOI multi-silicon wafer processes, Si Liwei's piezoelectric ultrasonic transducers are unique in the structure and process of single-wafer etching. They are mainly composed of suspended transmissive films, including bottom electrode, piezoelectric layer and top electrode. Elastic layer. By using the inverse piezoelectric effect of the piezoelectric material, as long as a fixed frequency voltage is applied to the bottom electrode and the top electrode on the upper and lower sides of the piezoelectric material film, the film vibrates to generate sound waves. Conversely, when the sound wave is transmitted to the transducing film, the film is deformed, and positive and negative opposite charges are generated at both ends of the piezoelectric layer, and the peripheral circuit can collect the generated electrical signal through the top electrode and the bottom electrode.
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
      In the fingerprint identification application, an alternating voltage is applied to the ultrasonic transducer, the ultrasonic transducer generates vibration, and the vibration is transmitted upward, that is, the ultrasonic wave is transmitted upward, and passes through different dielectric layers (screen, glass, etc.) to reach the valley or ridge of the finger. The sound wave encounters the surface of the ridge, partially reflected, partially transmitted, and because the acoustic impedance of the air in the valley is much higher than the ridge, the sound wave is almost totally reflected when it encounters the valley. When different sonic energy reflected from the valleys and ridges is transmitted to the corresponding ultrasonic transducer surface, the corresponding ultrasonic transducer generates different electrical signals (amplitude, frequency, phase, etc.).
     

      Compared with other fingerprint identification technology solutions, ultrasound technology can achieve 3D fingerprint recognition, and the security is higher. By acoustic focusing, the sound wave is focused on the surface of the finger. If the ridge of the finger is encountered, part of the sound wave is reflected back, and the rest of the sound wave is transmitted into the skin. This part of the sound wave is reflected back again after encountering the dermis layer; therefore, the sound wave encounters the ridge The two signals at different times are reflected back in the epidermis and dermis; in the valley, the sound waves are only reflected once and are totally reflected. The ultrasonic fingerprint identification scheme is to collect the fingerprint signals of the epidermis and the dermis by this method, thereby obtaining 3D fingerprint information.
      It is understood that the successful PMUT transducer developed by Sili Micro uses AIN material, based on CMOS technology, unique MEMS structure, simple structure and easy process realization. Si Liwei has already developed the on-screen ultrasonic fingerprint recognition based on this PMUT transducer. According to industry sources, it is expected that mass production will be achieved in early 2019.

      Attachment: Huiding three patent details

      Patent 1: terminal based on fingerprint recognition and login method and system in standby state
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront


    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
     
      Patent 2: Capacitive fingerprint sensing circuit and sensor
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront

    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront

    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
     
      Patent 3: Secondary package of through-silicon via chip
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront

    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront
    Sili Wei's statement on capacitive fingerprinting: optical/ultrasonic breakthrough makes it at the forefront

    p.s

    FPC는 Goodix를 제소,

    Goodix는 Silead를 제소 

    CN 104008319 B

    CN 104217193 B

    CN 207038516 U(모듈 패키징 관련)


    Silead 모 회사였던 GalaxyCore에서 Touch IC, CIS를 만들고 초음파 지문센서도 개발하고

    Silead는 기존 정전용량식, 광학식만 개발하는 것으로 알고 있었는데...

    (오래전에 들은 내용이라 반대로 Silead가 초음파, GalaxyCore가 광학식일 수 있으나 Silead가 광학식을 상용화 했으니...)

    GigaDevice에 Silead가 인수되면서 초음파 지문센서 부문도 팔렸나 보네요.

    30MHz active ultrasonic CMEMS sensor로 알려짐.

    Silead 주요 특허는 이곳에 정리 http://blog.daum.net/serapeum/7594607

    Goodix 2개 특허와 Silead 핵심 특허 우선일을 비교해보니 Silead가 더 빠르다.


    Xinyi Technology로 오역된 회사는 Sunwave-信炜科技임.

    PMUT(Piezoelectric Micromachined Ultrasonic Transducers)의 약자이고 MEMS센서와 같은 뜻으로 이해

    초음파 센서 설명중 Shanghai Sili Microelectronics는 Silead를 말함.


    Silead starts under-display fingerprint sensor R&D

    https://www.digitimes.com/news/a20180928PD214.html

    China-based fingerprint sensor supplier Silead has been engaged in the development of under-glass MEMS-based ultrasonic solutions, and expects to enter volume production of the under-display chips in early 2019.

    Silead disclosed its under-display fingerprint sensor R&D is based on the company's MEMS-CMOS platform utilizing piezoelectric micromachined ultrasonic transducers (PMUT).

    The adoption of full-screen displays has been growing among smartphones. With under-display fingerprint sensor demand for bezel-less smartphones set to boom, fingerprint sensor suppliers have stepped into the field with respective technology. Among the fingerprint identification sensor technologies, optical and ultrasonic solutions are being regarded as well suited for under-display fingerprint sensors for smartphones and other mobile devices, according to market observers.